Diamond Dicing Blades Without Hub, 1A8, for Wafer, Semiconductor Industry

• Customization: Available
• Blade Type: Dicing
• Manufacturing Process: Sintered
• Model NO.: 1A8
• Application: Cutting, Grooving, Dicing of Wafers
• Feature: Fast Cutting, Long Diamond Life, No Chipping
• Bond: Special Bond Design
• Cutting Condition: Wet
• Thickness: 0.002"-0.008"
• Diameter: 10mm-80mm
• Core/Body: No Core
• Advantage: Highly Durable
• Manufacturer: E-Grind
• Packing: Box
• Transport Package: Express, Air, Paper Box with Plastic Foam
• Specification: Diamond, Metal, Resin, fillters
• Trademark: E-Grind
• Origin: China
• HS Code: 68042210
• Production Capacity: 30000PCS/Year

Product Description

Dicing Blade without hub is a kind of ultra thin and precision diamond blade with excellent cutting ability, good rigidity and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramic, etc.

Our Diamond Dicing blades have below advantages:
1)High cutting speed
2)Free cutting action
3)Highly durable
4)Continuous uniformity and performance over time


Size Range:
 

Shape	Diameter(mm)	Thickness(mm)	H(mm)
1A8	10.0≤D≤80	0.08≤D≤0.2	4.0≤D≤114.3

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