• Diamond Blade Diamond Dicing Blade for Wafers
  • Diamond Blade Diamond Dicing Blade for Wafers
  • Diamond Blade Diamond Dicing Blade for Wafers
  • Diamond Blade Diamond Dicing Blade for Wafers
  • Diamond Blade Diamond Dicing Blade for Wafers
  • Diamond Blade Diamond Dicing Blade for Wafers

Diamond Blade Diamond Dicing Blade for Wafers

Application: Cutting, Grooving, Dicing of Wafers
Feature: Fast Cutting, Long Diamond Life, No Chipping
Bond: Special Bond Design
Cutting Condition: Wet
Thickness: 0.002"-0.008"
Diameter: 10mm-80mm
Samples:
US$ 0/Piece 1 Piece(Min.Order)
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Customization:
Diamond Member Since 2017

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Basic Info.

Model NO.
1A8
Core/Body
No Core
Advantage
Highly Durable
Manufacturer
E-Grind
Packing
Box
Transport Package
Express, Air, Paper Box with Plastic Foam
Specification
Diamond, Metal, Resin, fillters
Trademark
E-Grind
Origin
China
HS Code
68042210
Production Capacity
30000PCS/Year

Product Description

Dicing Blade without hub is a kind of ultra thin and precision diamond blade with excellent cutting ability, good rigidity and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramic, etc.

Our Diamond Dicing blades have below advantages:
1)High cutting speed
2)Free cutting action
3)Highly durable
4)Continuous uniformity and performance over time


Size Range:
 
Shape Diameter(mm) Thickness(mm) H(mm)
1A8 10.0≤D≤80 0.08≤D≤0.2 4.0≤D≤114.3

Other Products Of Ours:
Diamond Blade Diamond Dicing Blade for Wafers
Diamond Blade Diamond Dicing Blade for Wafers
Diamond Blade Diamond Dicing Blade for WafersDiamond Blade Diamond Dicing Blade for WafersDiamond Blade Diamond Dicing Blade for Wafers

 

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