10mm-80mm 1A8 Diamond Blade Diamond Dicing Blade for Wafers

• Customization: Available
• Application: Cutting, Grooving, Dicing of Wafers
• Feature: Fast Cutting, Long Diamond Life, No Chipping
• Model NO.: 1A8
• Bond: Special Bond Design
• Cutting Condition: Wet
• Thickness: 0.002"-0.008"
• Diameter: 10mm-80mm
• Core/Body: No Core
• Advantage: Highly Durable
• Manufacturer: E-Grind
• Packing: Box
• Transport Package: Express, Air, Paper Box with Plastic Foam
• Specification: Diamond, Metal, Resin, fillters
• Trademark: E-Grind
• Origin: China
• HS Code: 68042210
• Production Capacity: 30000PCS/Year

Product Description

Dicing Blade without hub is a kind of ultra thin and precision diamond blade with excellent cutting ability, good rigidity and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramic, etc.

Our Diamond Dicing blades have below advantages:
1)High cutting speed
2)Free cutting action
3)Highly durable
4)Continuous uniformity and performance over time


Size Range:
 

Shape	Diameter(mm)	Thickness(mm)	H(mm)
1A8	10.0≤D≤80	0.08≤D≤0.2	4.0≤D≤114.3

Other Products Of Ours: