Hybrind Bond Wafer Back Grinding Wheel

Product Details
Customization: Available
Material: Diamond
Abrasive: Superabrasive
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Diamond Member Since 2017

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  • Hybrind Bond Wafer Back Grinding Wheel
  • Hybrind Bond Wafer Back Grinding Wheel
  • Hybrind Bond Wafer Back Grinding Wheel
  • Hybrind Bond Wafer Back Grinding Wheel
  • Hybrind Bond Wafer Back Grinding Wheel
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Basic Info.

Shapes
6A2t
Types
Surface Grinding Wheel
Grain Size
D46 - D1
Cylindricity
<0.05
Circular Degree
<0.05
Technics
Sinter
Working Style
Surface Grinding
Application
Back Thinning
Wheel Body
Solid Aluminum
Transport Package
Paper Box
Specification
Diamond
Trademark
E-Grind or OEM
Origin
China
HS Code
68042110
Production Capacity
5000PCS/Year

Product Description

Wafer Back Grinding Wheel


E-Grind wafer back grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. E-Grind Wafer Back Grinding Wheels use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. The wafer grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.
 

Advantages of Wafer Back Grinding Wheel

  • Precision Grinding

  • High Material Removal Rate

  • Reduced Chipping and Damage

  • Improved Surface Finish

  • Longevity and Durability

 
Wafer Grinding Wheel Specification
Available shape 6A2T
Machine GALAXY, SPEEDFAM
Working Condition
Grinding Type Wet

With 40 years experience in Superabrasive industry, E-Grind Abrasives is a very reliable partner in supplying full range of Diamond and CBN grinding wheels for many industries: Woodworking, Die&Tooling, Bearing, Paper-Making, Automobile, Aerospace, Semi-Conductor...Our goal is to have 100% customer satisfaction. To gain this, E-Grind always provides customers the most competitive price, consistent quality, efficient service and the most effective tech support.

Our technology and bond systems are from US and Europe. The producing machines are mainly imported from US, Europe, Japan and Taiwan; Specially we have 6 CNC machines for the machining and grinding of Diamond CBN wheels; And the testing machines are also from Japan and Europe. All of these make our products to bepremium grade with high tolerance and to meet US and Europe standard and level.

Our capacity is 30, 000PCS of Diamond CBN wheels per month; Meanwhile we have more than 5000 sets of mold available; More than 8000 wheel specs; Thousands of standard wheels in stock; Customs made wheels are always available. All these make us to be able to supply wheels in very fast delivery time: 5 days for very urgent items and 14 days for standard items.

With more than 40 bond systems, 7 types of wheel body material and more than 4000 wheel specs available, Our experienced engineers are always ready to provide customers the application assistance and Tech support. For all the inquires, feedback or any other requirements, we always response within 24 hours. We could provide the improved products upon customer's feedback quickly.

With all of our advantage and our continuous hard working in R&D, the improvement of our producing&testing facility and cost decreasing, E-Grind will always provide customers the products with the best price-to-performance.

We look forward to nice cooperation with you!

Hybrind Bond Wafer Back Grinding WheelHybrind Bond Wafer Back Grinding WheelHybrind Bond Wafer Back Grinding WheelHybrind Bond Wafer Back Grinding Wheel

 

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