Customization: | Available |
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Material: | Diamond |
Abrasive: | Superabrasive |
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Precision Grinding
High Material Removal Rate
Reduced Chipping and Damage
Improved Surface Finish
Longevity and Durability
Wafer Grinding Wheel Specification | |
Available shape | 6A2T |
Machine | GALAXY, SPEEDFAM |
Working Condition | |
Grinding Type | Wet |