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Diamond Dicing Blades Without Hub, 1A8, for Wafer, Semiconductor Industry

Diamond Dicing Blades Without Hub, 1A8, for Wafer, Semiconductor Industry pictures & photos

Diamond Dicing Blades Without Hub, 1A8, for Wafer, Semiconductor Industry pictures & photos

Diamond Dicing Blades Without Hub, 1A8, for Wafer, Semiconductor Industry pictures & photos

Diamond Dicing Blades Without Hub, 1A8, for Wafer, Semiconductor Industry pictures & photos

Diamond Dicing Blades Without Hub, 1A8, for Wafer, Semiconductor Industry pictures & photos

Diamond Dicing Blades Without Hub, 1A8, for Wafer, Semiconductor Industry pictures & photos

Blade Type:	Dicing
Manufacturing Process:	Sintered
Application:	Cutting, Grooving, Dicing of Wafers
Feature:	Fast Cutting, Long Diamond Life, No Chipping
Bond:	Special Bond Design
Cutting Condition:	Wet

Samples:	US$ 0/Piece 1 Piece(Min.Order) \| Request Sample

Customization:	Available \| Customized Request

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