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Diamond Saw Blade
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Diamond Blade Diamond Dicing Blade for Wafers
On-Site Scanning
Precise Digital Duplicate
Angle Unlimited
Find Similar Items
Reference FOB Price
Get Latest Price
US $10.00-50.00
/ Piece
|
1 Piece
(Min. Order)
Application:
Cutting, Grooving, Dicing of Wafers
Feature:
Fast Cutting, Long Diamond Life, No Chipping
Bond:
Special Bond Design
Cutting Condition:
Wet
Thickness:
0.002"-0.008"
Diameter:
10mm-80mm
Samples:
US$ 0/Piece
1 Piece(Min.Order)
|
Request Sample
Customization:
Available
|
Customized Request
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